Integrated Circuit Packaging, Assembly and Interconnections

Name: Integrated Circuit Packaging, Assembly and Interconnections
Price: 178.50 EUR
Availability: InStock
Author: Greig, William J.
ISBN: 0387281533

Greig, William J.

inkl. MwSt. Versandinformationen

Artikel zZt. nicht lieferbar

Kurzinformation

Sprache:

Englisch

ISBN:

0387281533

Verlag:

Springer-Verlag GmbH

Seitenzahl:

300

Auflage:

Erschienen:

2007-05-01

Dieser Artikel steht derzeit nicht zur Verfügung!

Gebrauchte Bücher kaufen

Information

Das Buch befindet sich in einem sehr guten, unbenutzten Zustand.

Information

Das Buch befindet sich in einem sehr guten, gelesenen Zustand. Die Seiten und der Einband sind intakt. Buchrücken/Ecken/Kanten können leichte Gebrauchsspuren aufweisen.

Information

Das Buch befindet sich in einem guten, gelesenen Zustand. Die Seiten und der Einband sind intakt. Buchrücken/Ecken/Kanten können Knicke/Gebrauchsspuren aufweisen.

Information

Das Buch befindet sich in einem lesbaren Zustand. Die Seiten und der Einband sind intakt, jedoch weisen Buchrücken/Ecken/Kanten starke Knicke/Gebrauchsspuren auf. Zusatzmaterialien können fehlen.

Neues Buch oder eBook (pdf) kaufen

Information

Neuware - verlagsfrische aktuelle Buchausgabe.

Neu bei

bestellen E-Book bei

bestellen

Handgeprüfte Gebrauchtware

Schnelle Lieferung

Faire Preise

inkl. MwSt. Versandinformationen

Artikel zZt. nicht lieferbar

Weitere Zahlungsmöglichkeiten

Beschreibung

Integrated Circuit Packaging, Assembly and Interconnections

Trends and Options

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics. von Greig, William J.

Produktdetails

Einband:

Gebunden

Seitenzahl:

300

Erschienen:

2007-05-01

Sprache:

Englisch

EAN:

9780387281537

ISBN:

0387281533

Verlag:

Springer-Verlag GmbH

Gewicht:

668 g

Auflage:

Alle gebrauchten Bücher werden von uns handgeprüft.
So garantieren wir Dir zu jeder Zeit Premiumqualität.

Über den Autor

Greig, William J.

About the Author A graduate of Fordham University with a BS in Physics Bill has had extensive experience in Microelectronics covering semiconductor processing and assembly, Hybrid Circuits, and PWB fabrication and assembly. He began his career with RCA Semiconductor Division and subsequently worked for General Electric and Lockheed Electronics. While at RCA he was awarded six U.S. patents covering wafer processing and semiconductor assembly. At General Electric he was a staff engineer and consultant for hybrid circuits and PWB manufacturing. As Manager of Advanced Development at Lockheed, he was directly responsible for the design, construction, and operation of a state of the art Microelectronic Packaging facility supporting research, development, and manufacture of advanced hybrid circuits and multichip modules. He became an independent consultant in 1988. His clients have included material suppliers, assembly equipment manufacturers, and component manufacturers. His consulting activities has included work at NASA Headquarters in Washington D.C. where he provided technical expertise and assistance in developing an Advanced Integrated Circuit Packaging and Assembly Program. Bill specializes in packaging and assembly, focusing on high density substrate manufacturing, and chip assembly including flip chip and chip scale packaging. His company offers assistance in technology assessment and implementation, and specializes in technical audits of manufacturing operations directed towards yield improvement and reliability enhancement. He has developed several educational and training courses which are offered at various national and international symposia and on-site presentations. He is an active member of IMAPS where he is a Fellow of the Society and Past President of the Garden State Chapter.