Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal...

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A comprehensive guide to 3D IC integration and...

"Semiconductor Advanced Packaging" von John H. Lau ist ein umfassendes Werk, das sich mit den fortschrittlichen Technologien und Methoden im Bereich der Halbleiterverpackung befasst. Das Buch behandelt eine Vielzahl von Themen, darunter...