
IUTAM Symposium on Mesoscopic Dynamics of Fracture Process and Materials Strength
Kurzinformation



inkl. MwSt. Versandinformationen
Artikel zZt. nicht lieferbar
Artikel zZt. nicht lieferbar

Beschreibung
This volume contains the papers presented at the IUT AM Symposium of "Mesoscopic Dynamics of Fracture Process and Materials Strength", held in July 2003, at the Hotel Osaka Sun Palace, Osaka, Japan. The Symposium was proposed in 2001, aiming at organizing concentrated discussions on current understanding of fracture process and inhomogeneous deformation governing the materials strength with emphasis on the mesoscopic dynamics associated with evolutional mechanical behaviour under micro/macro mutual interaction. The decision of the General Assembly of International Union of Theoretical and Applied Mechanics (IUT AM) to accept our proposal was well-timed and attracted attention. Driven by the development of new theoretical and computational techniques, various novel challenges to investigate the mesoscopic dynamics have been actively done recently, including large-scaled 3D atomistic simulations, discrete dislocation dynamics and other micro/mesoscopic computational analyses. The Symposium attracted sixty-six participants from eight countries, and forty two papers were presented. The presentations comprised a wide variety of fundamental subjects of physics, mechanical models, computational strategies as well as engineering applications. Among the subjects, discussed are (a) dislocation patterning, (b) crystal plasticity, (c) characteristic fracture of amorphous/nanocrystal, (d) nano-indentation, (e) ductile-brittle transition, (f) ab-initio calculation, (g) computational methodology for multi-scale analysis and others. von Kitagawa, H.
Produktdetails

So garantieren wir Dir zu jeder Zeit Premiumqualität.
Über den Autor
- hardcover
- 344 Seiten
- Erschienen 2015
- Wiley-VCH
- paperback
- 560 Seiten
- Erschienen 2008
- Springer
- paperback
- 535 Seiten
- Erschienen 1996
- Pearson
- hardcover
- 683 Seiten
- Erschienen 2020
- Springer
- paperback
- 351 Seiten
- Erschienen 2000
- Ernst & Sohn Verlag
- Gebunden
- 858 Seiten
- Erschienen 2006
- Wiley-VCH
- paperback
- 340 Seiten
- Erschienen 2013
- Springer
- Gebunden
- 285 Seiten
- Erschienen 2018
- Springer
- Hardcover
- 542 Seiten
- Erschienen 2012
- Wiley
- Gebunden
- 510 Seiten
- Erschienen 2018
- Springer